Evaporation system is formed for two independent UHV chambers with a base pressure of 10-10 mbar. One of them is equipped with an e-beam evaporation source, which allows the deposition of metals and metal in substrates up to 51 cm diameter. The second chamber is for molecular materials deposition. The setup affords the controlled deposition of ultra-thin films up to 0.5 nm thickness. The deposition system is specially designed for the fabrication of hybrid structures, like spin-valve, spin-OLEDs, formed of thin layers of inorganic and molecular materials. Samples can be moved between both vacuum chambers in UHV environment without being exposed to air.